发明名称 Fabrication method of semiconductor device
摘要 A method of fabrication of a semiconductor device by forming a thin film pattern in the emitter region, forming a base lead-out electrode self-aligningly by using this thin film pattern, and also forming a fine graft base region and emitter region, and an oxide film for isolating the emitter region and base region, whereby the emitter diffusion layer and active base diffusion layer are formed in a shallow depth of diffusion by heat diffusion from the semiconductor film in which ions are implanted.
申请公布号 US4693782(A) 申请公布日期 1987.09.15
申请号 US19860903132 申请日期 1986.09.03
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KIKUCHI, KAZUYA;KOMEDA, TADAO;FUJITA, TSUTOMU
分类号 H01L21/033;H01L21/225;H01L21/285;(IPC1-7):H01L21/306;B44C1/22;C03C15/00;C03C25/06 主分类号 H01L21/033
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