发明名称 |
Apparatus for cooling integrated circuit chips |
摘要 |
A boiling type cooling structure for cooling semiconductor chips mounted on printed circuit cards, with a heat conductive stud being attached to the surface of each chip. Cooling plates with fins, arranged so as to surround the circumference of each heat conductive stud, are placed between the printed circuit cards in order to condense the vapor bubbles produced near the heat conductive studs.
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申请公布号 |
US4694378(A) |
申请公布日期 |
1987.09.15 |
申请号 |
US19870000128 |
申请日期 |
1987.01.02 |
申请人 |
HITACHI, LTD. |
发明人 |
NAKAYAMA, WATARU;HIRASAWA, SHIGEKI;NAKAJIMA, TADAKATSU |
分类号 |
H01L23/427;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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