METHOD FOR ELECTROPLATING NON-METALLIC SURFACES

摘要

Method for electroplating non-metallic surfaces on a substrate, e.g. of plating holes in metal clad laminates, is disclosed. Metallic sites are formed on the surface and the resulting site-containing surface is electroplated with an electroplating bath comprising a component which causes the plating to preferentially occur at these sites as opposed to the plating on surfaces of the same metal as the one plated out; whereby a rate differential of the plating-reaction on site-surfaces is achieved with respect to the plating-reaction on a surface consisting of the metal to be plated out. The metal deposited is different from the metal existing at the deposition surface.