发明名称 DEVICE FOR ADJUSTING MOLD TEMPERATURE
摘要 PURPOSE:To enable the titled device to perform quick heating, quick cooling and slow cooling processes by a system, by a method wherein a high-temperature and low-temperature heating medium tanks are provided independently and medium circuits among the heating medium tank and molds are put into exclusive uses for a high- temperature heating medium and low-temperature heating medium excepting a part of the circuits. CONSTITUTION:To begin with, a mold temperature of a rest 2 is preset to a predeter mined temperature by a heating medium of an intermediate-temperature tank 1a. Then as high-temperature medium control cylinder valves S1, S3, S5, S7 are released, openings of high-temperature medium control flow control valves V1, V3, V5 V7 are controlled through adjusting and each of insertion pieces 6a-6d performs heat exchange with a high-temperature medium by an instruction signal from a controller 5 in a heating process, a mold is heated up to a preset temperature. The mold tempera ture is kept at a fixed one in an injection process and a cavity is filled with resin. A cooling process is performed by making use of a low-temperature medium of a low-temperature tank 1c. A slow cooling process is performed by a fine adjusting unit 10 and the low-temperature medium does not return to the low-temperature tank 1c. Quick heating, quick cooling and slow cooling processes are performed by a system link this and shortening of a molding cycle can be attained.
申请公布号 JPS62208918(A) 申请公布日期 1987.09.14
申请号 JP19860052830 申请日期 1986.03.11
申请人 HITACHI LTD 发明人 INAGE HISAO;TAKAGI MASAO;EGUCHI SHOKI;YATSUDA NORIO;ARAI YOICHIRO
分类号 B29C33/04;B29C45/26;B29C45/73;B29C45/78;B29L11/00 主分类号 B29C33/04
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