| 摘要 |
PURPOSE:To make a semiconductor material cuttable so efficiently without entailing any bending and deflection, by setting a ratio of mean width to a mean thickness of 15-80mu to a range of less than 200 and also to a range of 5-18S in surface roughness, in case of a strip super-thin cutter for cutting the semiconductor material. CONSTITUTION:A strip super-thin cutter 6 of a multi-band saw cutting a semiconductor material consists of an amorphous alloy on the basis of one kind or more than two kinds of Fe, Ni and Co. And, the cutter is formed so as to set the mean thickness to Tmm, the mean width to Wmm, and to set such mean width satisfying a relation of W/T <=200 to a mean thickness of T=15-18mu, and also to cause the surface roughness to become a range of 5-18S. Thus, such a long-life super-thin cutter that is excellent in working properties, well resistible to large tension and able to cut a workpiece efficiently without entailing any bending and deflection, besides profitable in a yield rate, is securable. |
