| 摘要 |
<p>PURPOSE:To reduce the waveform distortion of a high speed digital signal and the propagation delay time by outputting a signal inputted to a package as it is through a distribution line having a constant characteristic impedance in the package in a semiconductor device comprising plural digital ICs requiring the high speed operation. CONSTITUTION:Two systems are used by using forward/return paths of I/O pins, wirings in the package and bonding wires or the like from a branch point existing as an open stub in connecting high speed ECL elements on a board without fail conventionally. For example, an input signal is subject to feed- through in the packages 12a, 12b while keeping the characteristic impedance Zo constant and the signal is outputted as it is. The outputted signal is inputted again to a next multi-chip package. The signal propagation delay time between the packages connected in cascade is not so much different from a general mounting form where no signal is transmitted in the packages. However, the waveform distortion is less by the length of the open stub decreased extremely and the delay time of the signal is decreased after all.</p> |
