| 摘要 |
PURPOSE:To enable a resin to be hardened within a short time subject to specified configulation by a method wherein an ultraviolet ray hardening type resin is injected into a vessel containing a semiconductor element to be irradiated with ultraviolet rays passing through the wall of vessel. CONSTITUTION:A vessel 1 is formed of one kind of resin selected out of polyamide resin, polycarbonate resin, acrylic resin, polyarylate resin or polysulfonic resin. A semiconductor element is correctly held in the vessel 2 while silicon or urethane denatured acrylate resin 6 is injected from a resin injector 4 to be hardened by multiple ultraviolet rays 7 passing through the vessel 2. Through these procedures, the resin 6 can be hardened within a very short time of 1-5min for resin-sealing process while a semiconductor element contained in the vessel 2 is resistant to external force subject to no stress imposed by the hardening process within the time specified.
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