发明名称 DYNAMIC RANDOM ACCESS MEMORY
摘要 PURPOSE:To prevent the voltage withstanding capability of a cell transistor source/drain junction from lowering by a method wherein the upper end of a counter electrode is positioned lower than and separated from the source/drain region of the cell transistor and an insulating layer is provided to occupy the gap thus created. CONSTITUTION:A groove 4 runs inward from the surface of a semiconductor substrate 1 of one conductivity type and a first conductive layer 5 of the same conductivity type, coating the inside walls of the groove 4, serves as a counter electrode for a capacitor. A second conductive layer 7 of the opposite conductivity type is formed through the intermediary of a dielectric layer 6 and fills up the groove 4, and serves as a storage capacitor accumulating electrode. The upper end of the first conductive layer 5 in such a storage capacitor is positioned lower than the bottoms of the source/drain regions 9A and 9B of a MIS transistor, and a gap is provided between the first conductive layer 5 and the bottoms of the source/drain regions 9A and 9B. Further, if required, an insulating layer 8 is provided in the gap thus created. This design prevents the voltage withstanding capability of a source/drain junction from lowering.
申请公布号 JPS62208659(A) 申请公布日期 1987.09.12
申请号 JP19860045822 申请日期 1986.03.03
申请人 FUJITSU LTD 发明人 TAGUCHI MASAO
分类号 H01L27/10;G11C11/403;H01L21/8242;H01L27/108 主分类号 H01L27/10
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