| 摘要 |
PURPOSE:To facilitate a process by manufacturing a groove or a hole for making an excess resin flow out outside in part of a recessed part or a dam on a substrate. CONSTITUTION:An IC chip 2 is mounted in a recessed part 7 provided on a substrate 1 and a sealing resin is dipped from over that. The formation of a clearance groove 8 to interconnect from the recessed part 7 to the side surface of the substrate can be either of it is made at the time of manufacture of the substrate or it is made when a dam being cut at the part of the groove is provided on the substrate. According to such a way, an excess resin passes through the clearance groove 8 and flows out outside and the surface of the resin becomes naturally flat. Thereby, the manufacture of a flat surface is facilitated. |
