| 摘要 |
PURPOSE:To prevent the peeling of solder plating on a lead frame, and to obviate the deterioration in quality due to the adhesion of solder chip onto a semifinished product by guiding the lead frame, on which a semiconductor device is loaded, by a line contact. CONSTITUTION:A groove 2b avoiding a contact with a semiconductor element 1 on a lead frame 4 is formed in the longitudinal direction of a carrying rail 2, the cross sections of both side walls of the groove are formed to a ridging shape forming a smooth curved surface, and both side edges of the lead frame 4 are supported by the top sections of the ridging-shaped support surfaces 2a. Accordingly, since the carrying rail 2 is brought into line-contact with the lead frame 4 and frictional resistance due to a surface contact is reduced, the generation of solder chips due to the peeling of solder plating is minimized, and solder chips fall from the ridging-shaped projecting edges in the rail 2 even when chips are generated, thus preventing the clogging of solder chips into the rail 2 and adhesion and the like to semifinished products.
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