| 摘要 |
PURPOSE:To prevent the effect of the whole package for an ultra-high frequency element on characteristics observed from an external lead, and to determine said characteristics only by the characteristics of a laminated ceramic element by using the central conductor coaxial type laminated ceramic element taking a rectangular parallelopiped shape for connecting the external lead and an electrode for a semiconductor element in a cavity. CONSTITUTION:With a package for an ultra-high frequency element, parts in which three laminated ceramic elements 3 are joined in parallel by means of Ag-Cu solder are incorporated to one surface of the package and the other surface oppositely faced to the surface. The lower surfaces of the laminated ceramic elements 3 are joined with an outer-wall metallic member 8 and upper surface thereof with a metallic member 7 for sealing a cap by means of Ag-Cu solder. One ends of metallized wiring patterns 4 for the laminated ceramic elements 3 are connected to an electrode for a semiconductor element 1 mounted into a cavity for the package by bonding wires 2, and external leads 6 are joined with the other ends by Ag-Cu solder. With the laminated ceramic elements 3, lower layer sections and upper layer sections thereof take a different shape but both lower and upper layer sections take a rectangular parallelopiped shape, and the metallized wiring patterns 4 are shaped at approximately central positions of the lower layer sections. |
