| 摘要 |
<p>PURPOSE:To reduce cost by interposing a spacer in predetermined thickness between a semiconductor element and a substrate when the semiconductor element is connected to the substrate through solder. CONSTITUTION:A terminal 2 for soldering is formed onto a substrate 1, and a spacer 3 is fixed. Height after fixing the spacer 3 is not made higher than that of a soldering ball 4 at that time. An element is tacked at the prescribed position of the substrate by using flux or the like heated and soldered-joined. Solder melted at that time is wetted and spread to the terminal 2 for soldering, and the height of connection is controlled by the spacer, thus forming the soldering ball 4 to hourglass-shaped solder 6. Flux is removed, and the element 5 is coated with a protective resin. Accordingly, connection having high density and high reliability can be acquired at low cost.</p> |
