| 摘要 |
PURPOSE:To simplify a treatment process by removing a resin burr generated when a semiconductor element is sealed with a resin by a laser. CONSTITUTION:Prismatic reflecting mirrors 2, 3 are moved by a linear motor so that laser beams are shifted in the X and Y directions, and resin burr sections 9 on external lead-out leads 8 for semiconductor devices 6 sealed with a resin under the state of a lead frame 7 are removed through laser-beam irradiation. A pattern glass mask 4 and a condenser lens 5 are mounted between the prismatic reflecting mirror 3 and the lead frame 7 so that a main body is not irradiated by laser beams. Consequently, an output from a laser is controlled, thus removing only the resin burrs on the lead frame without damaging the external lead-out leads under the resin burrs. Accordingly, treatment by a solution containing impurities, such as Cl<->, Na<+>, etc., is eliminated, and the mandays of washing by the solution can be reduced.
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