| 摘要 |
PURPOSE:To use a sealing resin properly in response to objects, and to improve characteristics and flatness by forming the resin onto a substrate in a multilayer manner and sealing a semiconductor element and the like. CONSTITUTION:A semiconductor element 3 is bonded onto a substrate 1 by using a die bonding material 2, and connected electrically by metallic small-gage wires 4, and a resin 5 for primary sealing having high reliability is dropped onto the substrate 1, thus sealing the semiconductor element 3 and the like. The quantity of the sealing resin is made smaller than the volume of the inside of a dam 7 at that time, and the surface of the resin after sealing is made more recessed than the upper surface of the dam. The primary sealing resin 5 is cured, and a resin 8 for secondary sealing having excellent moldability is dropped onto the resin 5 for primary sealing, and cured. Accordingly, the resins are used properly, making the most of the properties of the resins in the manner of a molding by the resin having superior moldability after a sealing by the resin having high reliability, thus easily acquiring the flatness of the surfaces of the resins while improving reliability. |
