| 摘要 |
PURPOSE:To obtain a compact, inexpensive semiconductor device, without bonding many lead wires, by providing a conductor plate on a semiconductor element. CONSTITUTION:A conductor plate 7 is soldered on a semiconductor element 1 beforehand. Lead wires 4 are bonded to the conductor plate 7 and an outer electrode 6b. Since the conductor plate 7 is soldered to the entire surface of the semiconductor element 1, a flowing current is dispersed through the entire surface of the semiconductor element 1. Many lead wires are not required to be bonded. Thus the semiconductor device can be compact and inexpensive by that degree.
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