| 摘要 |
PURPOSE:To provide a defective marking immediately after measurement, by attaching a marker, which gives a mark on the surface of a semiconductor wafer that is sucked to a transfer arm, to an X/Y stage mechanism. CONSTITUTION:A marker (inker) INK is attached to an XY stage X-Y, which is arranged in the horizontal direction. After measurement, the position information of each chip in a semiconductor wafer to be measured, which is conveyed on a transfer arm TRAM, can be readily computed based on the relative position information of a wafer chuck CT and the transfer arm TRAM. The position of the XY stages S-Y is controlled based on the position information of the defective chip obtained from the result of the measurement. The marker is moved in correspondence with the defective result of the measurement can be performed immediately after the measurement.
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