发明名称 RESIST COATING EQUIPMENT
摘要 PURPOSE:To form an uniform resist film, by installing wafer-temperature regulator which performs wafer-temperature regulation as a pretreatment of resist coating. CONSTITUTION:A brine-temperature regulator 11 heats or cools such that a brine temperature is made equal to a resist temperature in accordance with the difference between the resist temperature on a resist-temperature detecting terminal 10 and the brine temperature on a brine-temperature detecting terminal 9. The temperature-regulated brine is sent into a heat exchanger 7 from a tank 15 of the brine-temperature detecting terminal by a circulation pump 12 via the inner part of a rotary shaft 14. A wafer heated by a pre-heater is fixed on the adhering surface of a heat exchanger 7 in a spin-chuck 4A, and heat exchange is performed via the adhering surface. After the surface temperature of the wafer is stabilized, resist is spouted from a nozzle 6 and the spin-chuck 4A is rotated at a high speed. A thin resist film is formed on the wafer, thereby.
申请公布号 JPS62205626(A) 申请公布日期 1987.09.10
申请号 JP19860049952 申请日期 1986.03.05
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKAISHI YUTAKA;HIRANO HIROSHI
分类号 H01L21/027;B05C11/08;G03F7/16;H01L21/30 主分类号 H01L21/027
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