| 摘要 |
PURPOSE:To double the packaging density of a device, by facing a pair of semiconductor chips, and holding and fixing the inner ends of the lead frame of a film carrier between the metallic projections at reflection symmetry positions. CONSTITUTION:Leads 4 of a film carrier 3 are held and bonded between terminal electrodes or dummy bumps at reflection symmetry positions. The leads 4, which are bonded between bump electrodes 11 and 21, 12 and 22, and 13 and 23, can be connected to address buses as the common terminals of chips 1 and 2. By the same way, the leads, which are bonded between bump electrodes 16 and 26, 17 and 27, and 18 and 28, are connected to data buses as common terminals. The leads, 4, which are bonded between a pump electrode 14 and a dummy bump 24 and a bump electrode 25 and a dummy dump 15 can be connected to dedicated wirings, respectively.
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