| 摘要 |
PURPOSE:To prevent a crack and the displacement of wirings from occurring by bonding a filmy protective coating material on the surface of a semiconductor pellet so that part is extended from the outer periphery of the pellet toward outside. CONSTITUTION:A semiconductor pellet 1 is mounted on a bed 2 by mounting paste 4. A filmlike coating material 5 is bonded to the surface of the pellet 1. The shape of the material 5 is larger than the pellet 1, and a cutout is formed so as not to cover the portion of a bonding pad 7. Inner leads 3 are electrically connected to the pads via bonding wirings 6. According to this, it can prevent a resin crack, a pellet crack, a PSG crack and the displacement of aluminum wirings disconnection can hardly occur. When the material 5 is increased in thickness by the prescribed degree, a software error due to alpha-ray can be prevented. |
