Liquid cooling system for integrated circuit chips.

摘要

A cooling system for an electronic system comprises a connector mounted on a panel and an integrated circuit package removably connected to the connector by a mounting frame. A layer of heat conductive bonding material is provided between the package and a heat conductive member which is removably secured to a water-cooling heat exchanger. A plurality of guide posts are secured to the panel for holding the heat exchanger. Each guide post is formed with an externally threaded portion which engages with a thumb nut. A coil spring is provided between each thumb nut and the heat exchanger to exert a predetermined amount of contact pressure between the connector and package and take the weight of the heat exchanger.