发明名称 POLISHING METHOD FOR MAGNETIC HEAD
摘要 PURPOSE:To make high density recording possible by preventing polishing caused by collision of free abrasive grains by bonding a block for polishing on a block of a slider section on which a soft magnetic thin film pattern and a protective film are formed when polishing the magnetic head slider section. CONSTITUTION:A block 14 is bonded to the slider section 10 of a magnetic head with an epoxy group bonding agent applying heat and pressure to the block. Bonded slider section 10 and block 14 are fixed by a polishing jig, and the polishing jig is planetary rotated to rotation of a lapping plate 16 and polished with embedded abrasive grains 17, free abrasive grains 18 and processing solution 19 under a fixed load. At this time, polishing action on the soft magnetic thin film pattern 12 of the magnetic head and protective film 12 due to collision of free abrasive grains 18 can be prevented by the block 14, and level difference between a substrate 11 and the soft magnetic thin film pattern 12 can be reduced. Then, the epoxy group bonding agent 15 at the bonded slider section 10 and block 14 is dissolved by ethyl formamide and the magnetic head and block 14 are separated and used as an ordinary magnetic head.
申请公布号 JPS62204423(A) 申请公布日期 1987.09.09
申请号 JP19860046656 申请日期 1986.03.03
申请人 NEC CORP 发明人 KANEKO HIDEKI
分类号 B24B19/24;B24B37/00;G11B5/187;G11B5/31;G11B5/60 主分类号 B24B19/24
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