发明名称 LEAD BENDING METHOD AND APPARATUS THEREOF IN MANUFACTURING PROCESS OF ELECTRONIC DEVICE
摘要 PURPOSE:To perform a roller bending on a plurality of leads of the semimanufactured article before they are bent without making the constitution of the device complicate by a method wherein semimanufactured leads are bent using the roller bending method arranged corresponding to the interval of the semimanufactured articles. CONSTITUTION:A cutting and picking out means 2a and 2b are arranged at two places in feeding direction of a lead frame F leaving the interval of 3 pitches in the midway of a conveying path 1, the electronic device which is cut off and drops on the lower side of said means 2a and 2b is received, and a shooter 4 with which the electronic device D is conveyed to the roller bending position of the roller bending means 3a and 3b which are positioned on the side of the cutting and picking out means. The roller bending means 3a and 3b have a receiving jig 5 with the cross-section same as that of a guide rail and a pair of rollers 6 and 6 which perform a vertical movement by a vertically moving means. The electronic device is placed on the receiving jig 5, and when the rollers 6 and 6 are moved downward, a lead L is pressed against the side face of the receiving jig 5 by the rollers 6 and 6, and it is bent downward at right angle.
申请公布号 JPS62204559(A) 申请公布日期 1987.09.09
申请号 JP19860047806 申请日期 1986.03.04
申请人 ROHM CO LTD 发明人 MATSUYAMA FUSAO
分类号 H01L23/50;B21F1/00;H01L21/48;H01L23/48 主分类号 H01L23/50
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