| 摘要 |
PURPOSE:To prevent generation of conductive rust as well as to obtain electronic parts having a high degree of soldering strength of the external lead terminal by a method wherein a metal layer, having Pt, Pd, Rh and Au or their alloy as a main ingredient, is provided on the metallized metal layer located on the surface of an insulating substrate, and an external lead terminal is fitted to the metal layer using the soldering material having Au and Ge as the main ingredients. CONSTITUTION:A metallized metal layer 2 consists of the high melting point metal powder such as tungsten (W), molybdenum (Mo) or manganese (Mn) and the like, and the metal layer 2 is formed on the upper surface and the side face of an insulation substrate 1. A metal layer 4, having palladium (Pd), rhodium (Rh), gold (Au) or their alloy as the main ingredients, is formed in deposition on the side face part of the substrate 1 as a metallized metal layer 2. As the metal layer 4 is chemically stable to a high degree, a weak compound is never grown even when germanium is diffused when a soldering is performed on an external lead terminal 3 through the intermediary of the soldering material consisting of silver-germanium, and the bonding strength of the external terminal can be increased remarkably. |
