| 摘要 |
<p>Disclosed is a synthetic resin film wound capacitor, in particular a flat wound capacitor in a chip configuration, comprising a casing of a material that retains its shape under the effect of heat, for example a thermosetting synthetic resin, and connecting elements of a thin sheet metal attached to the ends of the capacitor such that sections of which project from the casing and are angled with respect to the frontal side of the capacitor. This synthetic resin film capacitor in a chip configuration resists thermal stresses during the overhead soldering of assembled printed circuits and therefore extends the possible applications of synthetic resin film capacitors. Also disclosed is a process for the manufacture of a capacitor according to the present invention.</p> |
