| 摘要 |
PURPOSE:To readily bond accurately a semiconductor chip without necessity of expensive devices by disposing the chip on the adhesive surface of a sheet with an adhesive press-bonded to a film, thermally press-bonding and fusion- hardening to uniformize the adhesive coating amount and thickness, to improve the high density mounting, and to uniformly disperse a substance added into the adhesive. CONSTITUTION:When a sheet with an adhesive in which an adhesive 1 of semicured state is formed on a thermoplastic film 2 is cut and divided into substantially the same size as a semiconductor chip, the surface of the adhesive 1 is sucked by vacuum suction means 5, and lightly thermally press-bonded on a silver-plated pattern 4 on a lead frame 3 preheated by a preheater 9, the film 2 is softened to be temporarily bonded to the pattern 4. A semiconductor chip 6 separated on a vinyl chloride sheet 7 is sucked by vacuum suction means 5, separated from the sheet 7, and strongly thermally press-bonded to the face of adhesive 1 on the film 2. |
