| 摘要 |
PURPOSE:To improve the heat dissipation of a circuit and mounting density by directly connecting a conductor layer to a section to be connected on mounting. CONSTITUTION:Side-surface wirings 23 consist of a metal such as gold, and grooves 22 formed tying the surface and the back in the side surface of a semiconductor chip 21 are buried with the wirings 23. Consequently, a semiconductor device 20 is chip-bonded with a mounting substrate 1, and mounted by connecting the side-surface wiring 23 to wirings 2 by solder 3. There is no element removing impedance matching such as wires in connecting sections under the state of the mounting, and the so-called face-up mounting is obtained and the semiconductor chip 21 is fast stuck to the mounting substrate 1 and heat dissipation is improved, thus sufficiently displaying the performance of a circuit 11a, then increasing mounting density. |
