| 发明名称 |
CURABLE BISIMIDE RESIN |
| 摘要 |
Cured resins of high fracture toughness are prepared from N,N'-bisimides of formula I <IMAGE> (I) and alkenyl compounds of formula II D(G)m II in which D is an m-valent group and G represents a phenyl ring having at least one alkenyl (e.g. allyl or 1-propenyl) substituent. |
| 申请公布号 |
JPS62201916(A) |
申请公布日期 |
1987.09.05 |
| 申请号 |
JP19870009786 |
申请日期 |
1987.01.19 |
| 申请人 |
TEKUNOKEMII GMBH |
发明人 |
HORUSUTO SUTENZENBAAGAA;PEETAA KOENITSUGU |
| 分类号 |
C08J5/18;B29C41/12;C07C41/00;C07C43/23;C07C43/257;C07C49/84;C07C67/00;C07C69/773;C07C69/80;C07C69/92;C07C313/00;C07C317/22;C07C317/44;C08F12/00;C08F20/52;C08F22/36;C08F212/00;C08F212/02;C08F212/34;C08F222/40;C08G73/12;D06M15/37 |
主分类号 |
C08J5/18 |
| 代理机构 |
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代理人 |
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