| 摘要 |
PURPOSE:To improve heat shock upon immersion in solder, by mixing an epoxy resin composition with a plurality of specified thermoplastic resins. CONSTITUTION:An epoxy resin composition is mixed with 0.5-10wt%, based on the total weight, at least two thermoplastic resins having softening points which are in the range of 10-220 deg.C and differ form each other by at least 20 deg.C. Said epoxy resin composition is one containing an epoxy resin, a curing agent, a cure accelerator and the thermoplastic resins and further contains, if necessary, additives such as a filler, a flame retardant, a treating agent, a pigment and a mold release. When the softening points of the thermoplastic resins used are lower than 100 deg.C, problems of storage stability and workability arise, and an effect of decreasing heat shock can not be attained. Preferably, it in the range of 100-160 deg.C. Examples of the resins include polyacetal (120 deg.C), polycarbonate (135 deg.C) and nylon (145 deg.C).
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