发明名称 IC PACKAGE WITH SIGNAL SETTER
摘要 PURPOSE:To impress an arbitrary signal on the prescribed terminal pins of an IC element connected by insertion to a small IC package by operating switches in the IC package which takes up little space by a method wherein the IC cover is provided with a plurality of contacts and a signal setting circuit including switches operable from the outside. CONSTITUTION:A plurality of contacts 8 are provided on the inside surfaces of an IC cover 5 and the contacts 8 are each made contact to 4 pieces of Nos.2, 21, 23 and 26 pins, No.14 pin and No.28 pin out of terminal pins 4a of an IC element 4. No.28 pin is a power terminal Vcc, No.14 pin is an earthing terminal GND and this point is earthed through a substrate 1. This grounded line is introduced in the IC cover 5 through the contacts 8 and are connected to the common connecting points of 4 switches S1-S4 of a digital switch 6. The other ends of the 4 switches S1-S4 and 4 resistors R1-R4 are individually connected and 4 pieces of the connecting points a-d are connected to Nos.2, 21, 23 and 26 pins of the IC element 4 through the contacts 8.
申请公布号 JPS62200748(A) 申请公布日期 1987.09.04
申请号 JP19860043015 申请日期 1986.02.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 KANEKO KOJI
分类号 H01L23/32;H01L23/50;H01R33/76;H01R33/945 主分类号 H01L23/32
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