发明名称 LEAD FRAME
摘要 PURPOSE:To prevent the generation of mustachelike flashes on the outer leads at the time of cutting of tie bars by a method wherein the tie bars for coupling mutually a plurality of the outer leads are each constituted by a plurality of fine bars and the holding of each outer lead and the prevention of outflow of a resin are contrived. CONSTITUTION:Outer leads 2 are coupled to one another by tie bars 3 extending in the rectangular direction to these outer leads. These tie bars 3 are each constituted of a common piece 3b provided at the central part between the mutually adjoining outer leads and 2 parallel fine bars 3a and 3a which are each extended toward the outer leads 2 from both sides of this common piece 3b and are each coupled to the adjoining outer leads 2. According to this lead frame 1, an element chip is resin-sealed in such a way as to include each point part of the outer leads 2 and a resin package 10 is constituted. When the tie bars 3 are cut after the resin sealing, a punch 4 of a comparatively smaller width compared to the mutually interval between the outer leads 2 is utilized. Therefore, even though a position deviation is generated in the outer leads 2 by the shrinkage or the deformation of the lead frame 1 after the resin sealing, the punch 4 does never interfere with the outer leads 2 and no mustachelike flash is generated on the outer leads 2.
申请公布号 JPS62200749(A) 申请公布日期 1987.09.04
申请号 JP19860041666 申请日期 1986.02.28
申请人 NEC KYUSHU LTD 发明人 MATSUKUMA HIDEMI;TSUJI YUKIHIRO
分类号 H01L23/50;H01L23/48;H01L23/495 主分类号 H01L23/50
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