发明名称 MANUFACTURE OF THERMOPLASTIC RESIN SHEET AND DEVICE THEREOF
摘要 PURPOSE:To prevent the quality of a thermoplastic resin sheet from lowering and contrive to reduce the energy to heat and melt chips during an extrusion process by a method wherein a passage, through which dried thermoplastic resin raw material passes, is lagged or heated. CONSTITUTION:A heating mechanism 7 consists of a pipe 71 which is windingly provided round the outer wall of a transporting pipe 4, a heating steam feed mechanism 72 to supply heating steam in the pipe 71 and insulating material 73 with which the pipe 71 and the transporting pipe 4 are wrapped. Thermoplastic resin chips, which are supplied from a storage tank 1 to a drying mechanism 2, are dried, while agitating, for example, at a temperature which is comparatively high provided below the melting temperature of the chip. After being dried at a drying mechanism 2, the chips are transported through the transporting pipe 4 to an extrusion mechanism 3. The transporting pipe 4 is heated up to a temperature such as about 140-180 deg.C by circulating heating steam, which is supplied from a heating steam feed mechanism 72 in the pipe 71 so as to pass the dried chips through the transporting pipe 4 in the above- mentioned heated state in order to transport them to the extrusion mechanism 3.
申请公布号 JPS62201228(A) 申请公布日期 1987.09.04
申请号 JP19860042816 申请日期 1986.03.01
申请人 KONISHIROKU PHOTO IND CO LTD;MITSUBISHI HEAVY IND LTD 发明人 SAITO SHUN;MASAOKA KAZUO;SHIODA TOMIO;MATSUSHITA MICHIO
分类号 B29C47/10;B29C47/78;B29L7/00 主分类号 B29C47/10
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