| 摘要 |
PURPOSE:The titled paste, containing a thermosetting resin, filler and specific butadiene-acrylonitrile copolymer, having high heat resistance and improved flexibility and useful for fixing and bonding semiconductor elements to stems or lead frames. CONSTITUTION:A paste containing (A) a thermosetting resin, e.g. epoxy resin, polyester resin, etc., (B) a filler, e.g. metallic powder of gold, silver, copper, etc., organometallic powder such as silver acetate, etc., having preferably <=10mu average particle size, and (C) a butadiene-acrylonitrile copolymer having terminal carboxyl groups or secondary amine groups.
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