发明名称 SEAL PACKAGE STRUCTURE
摘要 A sidebrazed ceramic package is provided with a closure seal that employs a high alumina ceramic lid that matches the composition of the package body. The lid is provided with a recess in the sealing face and the sealing face is provided with metallization that adheres to the ceramic and is wet by solder. The metallized ceramic lid is sealed to the metallization ring on the sidebrazed ceramic body by means of the conventional gold-tin solder. The resultant hermetic seal can be insepcted by observing the solder fillet in the lid recess. Such a closure seal is fully hermetic and can readily survive repeated thermal cycling.
申请公布号 GB8717887(D0) 申请公布日期 1987.09.03
申请号 GB19870017887 申请日期 1987.07.28
申请人 NATIONAL SEMICONDUCTOR CORPORATION 发明人
分类号 H01L23/02;B23K1/14;H01L21/50;H01L23/08;H01L23/10 主分类号 H01L23/02
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