发明名称 FLEXIBLE HEAT-RESISTANT RESIN COMPOSITION
摘要 PURPOSE:The titled composition, obtained by blending a specific amount of mica having a specified particle diameter with an aromatic polyamide-imide resin soluble in polar organic solvents, having improved heat resistance, moisture resistance, flexibility, etc., and further transparency and plane smoothness and suitable for flexible printed boards, etc. CONSTITUTION:A composition obtained by blending 95-65vol%, preferably 90-75vol% aromatic polyamide-imide resin, soluble in polar organic solvents, expressed by formula I or II (X is oxygen, sulfur, sulfonyl, etc.; n is >=2) or a mixture thereof and having >=0.5 reduced viscosity with 5-35vol%, preferably 10-25vol% plate, layer or scaly mica having 1-500mum, perferably 50-200mum particle diameter.
申请公布号 JPS62199651(A) 申请公布日期 1987.09.03
申请号 JP19860040332 申请日期 1986.02.27
申请人 NIPPON KOUDOSHI KOGYO KK 发明人 KIMURA TAKEO;CHIKAMORI SHUNJI;KOTANI MINAKO
分类号 C08J5/18;B32B15/08;B32B15/088;C08J5/24;C08K3/34;C08L79/08;H05K1/03 主分类号 C08J5/18
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