| 摘要 |
<p>PURPOSE:To enable the formation of bumps by a minute pad pitch by making the central part of a film thinner than that of an edge part in a film carrier on which bumps are formed via through-holes of the film. CONSTITUTION:A Cu wiring 11 pattern is formed on a polyimide film 12 and a central part of the film 12 is made thinner by etching. A through-hole is formed in the part which is to be in contact with an Al pad 16 and subsequently a bump 13 connected to the wiring 11 is formed. The bump 13 on the film 12 thus formed is positioned to be in accordance with the pad 16 and these are bonded by inner lead bonding. Consequently, the formation of bumps by a minute pitch becomes possible and a film for tape automated bonding having a high stiffness can be fabricated.</p> |
