| 摘要 |
PURPOSE:To minimize an occupied area at mounting by adopting the structure that the surrounding of a surface acoustic wave chip on a silicon chip by air gap so as to keep the air-tightness with molding. CONSTITUTION:A lead terminal 2 is provided at a prescribed interval in the lengthwise direction at both ends of a lead frame 1. An LSI pattern 3 is formed on the lead frame 1, a silicon chip 4 is subjected to die-bonding and a surface acoustic wave chip 5 is subjected to die bonding further on the chip. A cover 6 is covered to the upper opening of the lead frame 1 and an air gap 7 is formed so as not to disturb the vibration of the surface acoustic wave by the cover 6 and the lead frame 1. After the cover 6 is applied to the upper opening of the lead frame, 1 the silicon chip 4 formed with the lead frame 1, the LSI pattern 3 and the surface acoustic wave chip 5 if formed incorporatedly by a mold resin 8 in this way.
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