| 摘要 |
PURPOSE:To obtain a lead frame, in which the position accuracy of silver solder is high, by performing inlay bonding of the silver solder in a lead frame strip member, etching the solder, performing molding with the outer configuration of the frame and a minute part, and separating the frame at the silver brazing part. CONSTITUTION:Small stripes of a silver solder 2 comprising 28wt% Ag-Cu undergo inlay bonding on the right and left sides on a lead frame strip member 1 comprising 42wt% Fe-Ni. Then etching is performed, and pins 3 are formed at the outer configuration part of the frame and the minute part in the strip member 1. Then the silver solder art is pressed and cut, and the lead frame having the silver brazing is completed. In this constitution, the position accuracy of the silver solder is high and the silver solder is located on the same surface. Therefore alignment at the time of pin soldering is very excellent. Since there is no defect in spot wedding using tape soldering material as found in a conventional method, there is no breakdown of the pins after the silver brazing. |
