Improved micro-electronics devices and methods of manufacturing same.

摘要

A low dielectric constant material for use in the formation of thick film circuits such as VLSI devices. The material comprises a thick film insulation matrix of standard viscosity; a thick film organic vehicle; and a plurality of dry, hollow, glass microspheres (26). The insulation matrix, vehicle, and microspheres (26) are thoroughly combined into a homogeneous material of standard viscosity.