| 摘要 |
PURPOSE:To contrive the improvement in reliability of electrode pads and bonding parts by forming a through-hole at the end of a wiring and connecting an electrode pad to the wiring while pressing a metallic ball over a through-hole after positioning said through-hole to be in accordance with the electrode pad. CONSTITUTION:A Cu wiring 1 is formed on a polyimide film 2 and a through- hole is arranged in the part where the wiring is on an electrode pad 4 of an element 5. Above this through-hole, a capillary 6 and an Au ball 7 are set and these are pressed against to the pad 4 so that the device of such structure that the pad 4 is connected with the wiring 1 by an Au ball bump 8 can be obtained. In this method, because an element is not given a shock two times as in a ball-bump method, the reliability of electrodes pads and bonding parts can be improved.
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