发明名称 SEMICONDUCTOR PRESSURE SENSOR
摘要 PURPOSE:To obtain a semiconductor pressure sensor free from the fear of leaked pressure even under a high pressure, by making a lead pipe piercing a sensor body container communicating with a pipe joint metal while an insulating O ring is provided at the connection between the lead pipe and the pipe joint metal. CONSTITUTION:A flared type joint metal 1 is mounted at the bottom of an external container 2. When assembling is done by inserting a lower lead pipe 9 of a sensor body container 1 into an inner hole hole of the metal 11, an insulating junk ring 13 and to O-rings 12 are inserted into an insert section and the metal 11 is screwed down securely to the external container 2 to heighten the sealing effect. As the metal 11 is provided with a male thread 14, a female thread of the flared type pipe joint metal on the piping side can be connected thereto easily while the end of a measuring pressure pipe is pushed open to pinch it tight between the two pipe joint metals. When a high pressure A is applied through the metal 11, the O-rings 12 are pushed in the direction of the arrow but stopped on the side of the container 2. When the pressure A is applied on the vacuum side, the O-rings 12 are pulled opposite to the arrow but sealed securely with a stopper of the junk ring 13.
申请公布号 JPS62197731(A) 申请公布日期 1987.09.01
申请号 JP19860039784 申请日期 1986.02.25
申请人 FUJI ELECTRIC CO LTD 发明人 SAKAI TOSHIAKI
分类号 G01L19/00;G01L9/00 主分类号 G01L19/00
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