| 发明名称 |
PROCESS FOR FORMING CONDUCTIVE THROUGH-HOLES THROUGH A DIELECTRIC LAYER |
| 摘要 |
<p>TITLE PROCESS FOR FORMING CONDUCTIVE THROUGH-HOLES THROUGH A DIELECTRIC LAYER A conductive through-hole hole is formed through a dielectric sandwiched between conductors by forming a noncircular hole in a conductor. etching a hole through the dielectric and by deforming at the conductor which has been undercut during the etching.</p> |
| 申请公布号 |
CA1226373(A) |
申请公布日期 |
1987.09.01 |
| 申请号 |
CA19840469289 |
申请日期 |
1984.12.04 |
| 申请人 |
DU PONT (E.I.) DE NEMOURS AND COMPANY |
发明人 |
JOHNSON, DANIEL D.;FRITZ, HERBERT L. |
| 分类号 |
H05K3/00;H05K3/40;(IPC1-7):H05K3/42 |
主分类号 |
H05K3/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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