| 摘要 |
PURPOSE:To remove the generation of cracks and peeling of a protective film by forming the protective film from a solution in which a phenol-formaldehyde resin, one molecular thereof has at least one dibenzyl ether bond, is dissolved into a proper solvent. CONSTITUTION:A protective agent for the surface of a semiconductor substrate used for protecting the surface of the semiconductor substrate to which a pattern is formed completely consists of a phenol-formaldehyde resin, one molecule thereof has at least one dibenzyl ether bond. The phenol-formaldehyde resin is a polycondensation product synthesized by employing an acidic or basic catalyst from phenol and formaldehyde. Accordingly, the generation of cracks and peeling of a protective film is removed.
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