| 摘要 |
PURPOSE:To equalize the length of bonding wires, and to facilitate wire bonding by disposing an insulating substrate with a conductive pattern among chips on a chip bed and leads and among the chips. CONSTITUTION:Insulating substrates 11 with conductive patterns 11b on the upper surfaces of substrate body sections 11a formed by polyimide, glass epoxy, glass imide, etc. are arranged among chips 103 on a chip bed 101 and leads 102 and among the chips 103. The pattern 11b is shaped by plating a patterned copper foil and laminating and applying an Ni layer and an Au layer, and the substrate 11 formed in this manner is bonded with the bed 101 through thermosetting adhesives 12. |
