SUBSTRATE FOR MOUNTING SEMICONDUCTOR

摘要

PURPOSE:To obtain high bonding strength of a plate and a substrate by bonding the plate having a hole corresponding to a semiconductor placing unit and through-holes corresponding to externally connecting conductor pin mounting positions to the substrate having a conductor and through holes to increase the bonding areas of the plate and the substrate. CONSTITUTION:A plate 1 having a hole corresponding to a semiconductor placing unit 3 and through holes 7 corresponding to externally connecting conductor pin mounting positions is bonded to a substrate 2 having a conductor 4 and through-holes 5. The conductor pins 9 are fixed via the holes 7 to the substrate 2. Then, the bonding areas of the plate 1 and the substrate 2 are increased. Thus, high bonding strengths of the plate 1 and the substrate 2 are obtained.