发明名称 |
SOLID-STATE IMAGE PICKUP DEVICE |
摘要 |
PURPOSE:To obtain picture information having high resolution and reduced noises by providing a guide line to fix a solid-state image pickup element at a fixed position on a packing substrate and also using a material serving as a light absorbing layer for said guide line to avoid a case where the light is made incident on a photodetecting element due to diffused reflection of the light produced at the chip end of said image pickup element. CONSTITUTION:A solid-state image pickup element 11 is fixed at a fixed position on a transparent packing substrate 15 with high accuracy by means of a guide plate 14. Here the plate 14 is made of a material that can serve as a light absorbing layer. Thus it is possible to avoid formation of a diffused reflection surface on the chip end face of the element 11. The plate 14 uses a glass plate obtained by laminating a silicone resin plate and a light absorbing layer of amorphous resin, etc. Furthermore, a guide plate 23 is provided on a transparent packing substrate 24. Thus the chips of plural solid-state image pickup elements 21 can be set on a straight line with high accuracy.
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申请公布号 |
JPS62196979(A) |
申请公布日期 |
1987.08.31 |
申请号 |
JP19860039729 |
申请日期 |
1986.02.25 |
申请人 |
SEIKO EPSON CORP |
发明人 |
MATSUO SHUICHI;KURIHARA HAJIME;TAKESHITA TETSUYOSHI;TAKENAKA SATOSHI;OKA HIDEAKI;HASEGAWA KAZUMASA;KUNII MASABUMI |
分类号 |
H01L21/52;H01L21/58;H01L27/14;H01L27/146;H04N5/335 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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