METHOD OF ELECTROPLATING OF THIN GOLD LAYERS,申请号PL19830241435-传众专利搜索

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发明名称	METHOD OF ELECTROPLATING OF THIN GOLD LAYERS
摘要
申请公布号	PL141695(B1)	申请公布日期	1987.08.31
申请号	PL19830241435	申请日期	1983.04.11
申请人		发明人
分类号	C25D;C25D3/48;C25D5/10;(IPC1-7):C25D5/10	主分类号	C25D
代理机构		代理人
主权项
地址

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