发明名称 STICKING METHOD FOR SPACER MATERIAL
摘要 PURPOSE:To manage the sticking of a spacer material with uniform spraying density without leaving dirt on a board by irradiating ultrasonic waves to the mixed solution of the spacer material, boiling the mixed solution and dipping the board into the mixed solution. CONSTITUTION:An electrode is formed on the board 15 and an orientation film is formed on the electrode to obtain a dispersion tank 11 for forming a liquid crystal cell. Then, the spacer material is mixed to obtain the mixed solution 13 and the solution 13 is agitated and irradiated by ultrasonic waves so that the spacer material is uniformly dispersed in the mixed solution 13. Subsequently, the mixed solution 13 stored in the dispersion tank 11 is boiled by a heater 21 to maintain the uniform dispersion status of the spacer material. Then, the board 15 is dipped into the boiled mixed solution 13 by a lift 19 through a suspending means 17 so that the spacer material spraying surface is vertical to the liquid surface of the mixed solution 13. After the temperature of the board 11 has reached the boiling temperature of the mixed solution 13, the board 15 is lifted up from the mixed solution by the lift 19. At that time, only the spacer material is left on the surface of the board 11 and uniformly dispersed and stuck to the surface of the board 11 and isopropyl alcohol prevents the board 11 being dirtied.
申请公布号 JPS62195623(A) 申请公布日期 1987.08.28
申请号 JP19860036951 申请日期 1986.02.21
申请人 OKI ELECTRIC IND CO LTD 发明人 NISHIKI TAMAHIKO;SHIBATA SUSUMU;IKEHATA MASAO
分类号 G02F1/13;G02F1/133;G02F1/1339;G09F9/35 主分类号 G02F1/13
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