发明名称 RESIN SEALING DEVICE FOR SEMICONDUCTOR
摘要 PURPOSE:To relax the dispersion of the weight of a resin and to make all the final pressures to be applied to the resin to a constant by a method wherein, after each subcylinder is made to inject almost uniformly the resin by about 90% by the injection main cylinder, each subcylinder performs the final injection independently of one another. CONSTITUTION:A cylinder head 13 is positioned just under a subcylinder unit 12 and can be vertically moved by an injection main cylinder 21. In brief, subcylinders 11 can be lifted up by making the cylinder head 13 ascend. A resin can be injected by the subcylinders 11 only, but as the internal resistances of the subcylinders 11 and plungers 3 are different from each other, the ascending speeds of all the plungers 3 are not always constant. Accordingly, the subcylinders 11 are lifted up to about 90% of the height by the injection main cylinder 21 and to the remaining about 10% of the height, the subcylinders 11 only are each made to ascend independently of one another.
申请公布号 JPS62195135(A) 申请公布日期 1987.08.27
申请号 JP19860036634 申请日期 1986.02.21
申请人 NEC CORP 发明人 SHIBUYA KOJIRO;SATO WATARU
分类号 H01L21/56;B29C45/02;B29C45/14;B29L31/34 主分类号 H01L21/56
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