| 摘要 |
PURPOSE:To facilitate connection to other devices by fitting a terminal for connecting devices at the side end of a package. CONSTITUTION:Recessed surfaces 33 for connection prepared to a package for a semiconductor integrated circuit device 31 is formed for connection to projecting surfaces 34 for connection in another device, and each connected to an integrated circuit 32 by wirings 35. I/O terminals 37 inserted to a socket except connecting terminals are connected to the integrated circuit 32 by wirings 36. A groove 38 for an air vent is shaped. |
