| 摘要 |
PURPOSE:To form a terminal which can be soldered easily without degrading the characteristics of a photosensor by a method wherein, after a semiconductor thin film and electrodes of both surfaces are laminated on a substrate, the surface is covered with an insulating resin film which exposes the extension of the transparent conductive film and electrolytic plating is carried out with a plating metal as an anode and with the transparent electrode as a cathode. CONSTITUTION:A glass substrate 1 on which a number of photosensors 10 are formed is dipped in a plating bath 11 and electrolytic plating is carried out with an Ni electrode 12 as an anode and with a transparent conductive film drawn out on the upper part of the glass substrate 1 as a cathode. The transparent conductive film is extended from the terminal part 21 of a transparent electrode 2 to a source connecting part 23 through a lead-out part 22 provided at the boundary of the photosensors. As the photosensor 10 is covered with an insulating resin film 6 applied so as to expose only the terminal part 21 of the transparent conductive film, Ni plated layers are formed on the exposed terminal part 21, lead-out part 22 and source connecting part 23 only. If the lead-out part 22 and the source connecting part 23 are cut off and separated, the photosensor whose transparent electrode side terminal can be also soldered to a lead wire is obtained. With this constitution, deterioration of characteristics caused by damage and contamination of the sensor can be avoided and a low cost can be achieved. |
